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3-Layer Rigid-Flex PCB
Material:Polyimide (PI) 25µm + FR-4 (Tg170)
MOQ:1PCS
Price:36-49 USD/PCS
Packaging:Vacuum / Anti-static Packaging
Delivery Period:7-13 working days
Payment Method:T/T, Paypal

* FPCs are custom-made, picture & parameters for reference

Rigid-Flex 3-Layer PCB for Wireless Security Systems


Introducing Our 3-Layer Rigid-Flex PCB for Wireless Security Systems

We are excited to unveil our state-of-the-art 3-layer rigid-flex printed circuit board (PCB), specifically engineered for wireless security systems. With a thickness of 1.6mm at the rigid portions, this PCB is crafted from high-quality Tg170 FR-4 and polyimide materials, ensuring superior performance and reliability.


PCB Specifications

Click to expand/collapse the table
Size of Flexible PCB 91.5X 105.3mm
Number of Layers 3
Board Type Rigid-flex PCB
Board Thickness 1.6mm
Board Material Polyimide (PI) 25µm +FR-4
Board Material Supplier Shengyi
Tg Value of Board Material 135℃
PTH Cu thickness ≥20 µm
Inner Iayer Cu thicknes 35 µm
Surface Cu thickness 35 µm
Coverlay Colour Yellow / Green Solder mask
Number of Coverlay 2
Thickness of Coverlay 25 µm
Stiffener Material NO
Stiffener Thickness N/A
Type of Silkscreen Ink IJR-4000 MW300
Supplier of Silkscreen TAIYO
Color of Silkscreen White
Number of Silkscreen 1
Peeling test of Coverlay No peelable
Legend Adhesion 3M 90℃ No peeling after Min. 3 times test
Surface Finish Immersion Tin
Thickness of Surface Finish Tin: 0.8-1.5µm
RoHS Required Yes
Famability 94-V0
Thermal Shock Test Pass, -25℃±125℃, 1000 cycles.
Thermal Stress Pass, 300±5℃,10 seconds, 3 cycles. No delamination, no blistering.
Function 100% Pass electrical test
Workmanship Compliance with IPC-A-600H & IPC-6013C Class 2

Processes

Flow Diagram


Key Features and Advantages


Applications


Why Choose Us?

With our commitment to quality and innovation, we ensure that our PCBs are not only efficient but also reliable for various applications. Explore the future of PCB technology with us!



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